• DocumentCode
    349852
  • Title

    Optimization of two-element flow sensors by numerical simulations

  • Author

    Nagata, Mitsuhiko ; Stevens, Malcolm ; Swart, Nicholas ; Dravia, Thngaraj ; Nathan, Arokia

  • Author_Institution
    Control Products. Div., Yamatake Corp, Kanagawa, Japan
  • Volume
    1
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    373
  • Abstract
    Simulation and measurement results are presented for a two-element boundary layer flow sensor fabricated using silicon semiconductor processing and micromachining technologies. The sensor is located on a thermally isolated membrane and utilizes platinum-based resistive heating and sensing elements. Device optimization is based on quasi-3D numerical solutions of the electrothermal equations governing heat transport. We investigate the effects of geometrical non-idealities on the output response and offset. The results corroborate well with measurement data for a large range of operating voltages and flow velocities
  • Keywords
    boundary layers; differential equations; flowmeters; geometry; heat transfer; heating elements; membranes; micromachining; microsensors; numerical analysis; optimisation; semiconductor technology; Pt; Si; device optimization; electrothermal equations; flow velocity; geometrical nonidealities; heat transport; measurement data; micromachining; offset; operating voltage; output response; quasi-3D numerical simulations; resistive heating elements; resistive sensing elements; semiconductor processing; thermally isolated membrane; two-element boundary layer flow sensor; Biomembranes; Electrothermal effects; Fluid flow measurement; Heating; Isolation technology; Micromachining; Numerical simulation; Silicon; Thermal resistance; Thermal sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Emerging Technologies and Factory Automation, 1999. Proceedings. ETFA '99. 1999 7th IEEE International Conference on
  • Conference_Location
    Barcelona
  • Print_ISBN
    0-7803-5670-5
  • Type

    conf

  • DOI
    10.1109/ETFA.1999.815379
  • Filename
    815379