• DocumentCode
    3498859
  • Title

    Stacked flexible parylene-based 3D inductors with Ni80Fe20 core for wireless power transmission system

  • Author

    Xuming Sun ; Yang Zheng ; Zhongliang Li ; Xiuhan Li ; Haixia Zhang

  • Author_Institution
    Nat. Key Lab. of Sci. & Technol. on Micro/Nano Fabrication, Peking Univ., Beijing, China
  • fYear
    2013
  • fDate
    20-24 Jan. 2013
  • Firstpage
    849
  • Lastpage
    852
  • Abstract
    This paper presents a new high quality factor parylene-based stacked 3D spiral inductor with Ni80Fe20 core for wireless power transmission system. To achieve multilayers, planarization of parylene by oxygen plasma etching was realized. Ni80Fe20 was added as the magnetic core to enhance the performance. The maximum quality factor of the designed circular double-layer inductor reached 99.3 at 60MHz, which is much higher than the square coils with the same area. The double-layer inductor shows a 408% increment of maximum quality factor compared with single-layer coil. Furthermore, inductors with magnet arrays exhibited better performance than those with one magnet. Forming the power transmission system with these 3D inductors, the minimum attenuation was -26dB at 118MHz.
  • Keywords
    UHF circuits; coils; inductors; magnetic cores; magnetic devices; microfabrication; micromechanical devices; nickel compounds; sputter etching; MEMS 3D inductor; Ni80Fe20; circular double-layer inductor; frequency 118 MHz; frequency 60 MHz; gain -26 dB; magnetic array; magnetic core; multilayer-planarization; oxygen plasma etching; quality factor stacked flexible parylene-based 3D spiral inductor; single-layer coil; square coil; wireless power transmission system; Coils; Fabrication; Inductors; Magnetic cores; Micromechanical devices; Resists; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
  • Conference_Location
    Taipei
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4673-5654-1
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2013.6474376
  • Filename
    6474376