• DocumentCode
    3499926
  • Title

    VMOS, UMOS structures simulation in micro and nano scale

  • Author

    Kersys, T. ; Andriukaitis, D. ; Anilionis, R.

  • Author_Institution
    Dept. of Electron. Eng., Kaunas Univ. of Technol.
  • fYear
    2006
  • fDate
    2-4 Oct. 2006
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    VMOS, UMOS ("V"-groove-metal-oxide-silicon) transistors drain and gate are formed in the groove of "V" or "U" form. Expanding channel area, therefore VMOS and UMOS structures may be used in the power chips. Using VMOS, UMOS saves 40% free space than by using NMOS technology. Nanostructures dimensions are very small, so it is important to keep pn junction in a right depth, and in the all semiconductor manufacturing technological process. Analyzing influence to forming structure of each technological operation, mathematical simulation program SUPREM IV is used. VMOS and UMOS technological operation was simulated in micro and nano level
  • Keywords
    MOSFET; semiconductor device manufacture; NMOS technology; UMOS; V-groove-metal-oxide-silicon transistors; VMOS; semiconductor manufacturing technological process; Boron; Doping; Etching; Ion implantation; Manufacturing processes; Oxidation; Semiconductor impurities; Silicon; Space technology; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Baltic Electronics Conference, 2006 International
  • Conference_Location
    Tallinn
  • ISSN
    1736-3705
  • Print_ISBN
    1-4244-0414-2
  • Electronic_ISBN
    1736-3705
  • Type

    conf

  • DOI
    10.1109/BEC.2006.311055
  • Filename
    4100276