DocumentCode
3499926
Title
VMOS, UMOS structures simulation in micro and nano scale
Author
Kersys, T. ; Andriukaitis, D. ; Anilionis, R.
Author_Institution
Dept. of Electron. Eng., Kaunas Univ. of Technol.
fYear
2006
fDate
2-4 Oct. 2006
Firstpage
1
Lastpage
4
Abstract
VMOS, UMOS ("V"-groove-metal-oxide-silicon) transistors drain and gate are formed in the groove of "V" or "U" form. Expanding channel area, therefore VMOS and UMOS structures may be used in the power chips. Using VMOS, UMOS saves 40% free space than by using NMOS technology. Nanostructures dimensions are very small, so it is important to keep pn junction in a right depth, and in the all semiconductor manufacturing technological process. Analyzing influence to forming structure of each technological operation, mathematical simulation program SUPREM IV is used. VMOS and UMOS technological operation was simulated in micro and nano level
Keywords
MOSFET; semiconductor device manufacture; NMOS technology; UMOS; V-groove-metal-oxide-silicon transistors; VMOS; semiconductor manufacturing technological process; Boron; Doping; Etching; Ion implantation; Manufacturing processes; Oxidation; Semiconductor impurities; Silicon; Space technology; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Baltic Electronics Conference, 2006 International
Conference_Location
Tallinn
ISSN
1736-3705
Print_ISBN
1-4244-0414-2
Electronic_ISBN
1736-3705
Type
conf
DOI
10.1109/BEC.2006.311055
Filename
4100276
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