• DocumentCode
    3500053
  • Title

    A method for accelerating cycles of learning in the semiconductor equipment industry

  • Author

    Keller, Ed ; Bukhman, Jeff

  • fYear
    1993
  • fDate
    1993
  • Firstpage
    70
  • Lastpage
    73
  • Abstract
    The Manufacturing Technology Group (MTG) of Motorola has developed an approach to cooperating with equipment suppliers which allows for improving key manufacturing parameters of select process equipment at the supplier location. A technique is shared with the supplier which allows for improvements in critical manufacturing parameters in a systematic and rigorous manner aimed at shortening the cycles of learning. A key portion of this process is commonly referred to as the ´Ironman´ in current equipment evaluations. The approach allows for manufacturing robustness of software and hardware to be increased while maintaining separate but parallel programs for process improvement activities. This paper covers the demands by the factory of the future which require application of this approach, the actual learning technique shared with the supplier, and the strategies required to implement this concept. finally benefits expected from implementation of this approach will be discussed for both the equipment supplier and the device manufacturing partner.
  • Keywords
    equipment selection; learning systems; semiconductor device manufacture; device manufacturing partner; learning cycles; manufacturing parameters; manufacturing robustness; process improvement; semiconductor equipment industry; Acceleration; Application software; Hardware; Manufacturing industries; Manufacturing processes; Production facilities; Pulp manufacturing; Robustness; Semiconductor device manufacture; Software maintenance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Science Symposium, 1993. ISMSS 1993., IEEE/SEMI International
  • Conference_Location
    San Francisco, CA, USA
  • Print_ISBN
    0-7803-1212-0
  • Type

    conf

  • DOI
    10.1109/ISMSS.1993.263697
  • Filename
    263697