• DocumentCode
    3500607
  • Title

    Multi nozzle electrohydrodynamic inkjet printing head by batch fabrication

  • Author

    Lee, K.I. ; Lim, B. ; Lee, Hongseok ; Kim, S.H. ; Lee, Chris S. ; Cho, J.W. ; Chung, Shi-Uk ; Hong, Yiguang

  • Author_Institution
    Korea Electron. Technol. Inst., Seongnam, South Korea
  • fYear
    2013
  • fDate
    20-24 Jan. 2013
  • Firstpage
    1165
  • Lastpage
    1168
  • Abstract
    We report a multi nozzle electrohydrodynamic (EHD) printing head by using batch fabrication for the first time. Inks can be ejected from a glass nozzle by applied large electric field. Tiny nozzles with a outer diameter of 100 microns are fabricated by sand blasting on a glass wafer. A stable continuous jetting with a commercial carbon black ink was observed. Continuous lines with a width of 30 microns on a silicon wafer were printed simultaneously with a DC bias voltage of 1.7 kV at the stage speed of 500 mm/s. Separated dot patterns with a diameter of 20 microns were printed with various jetting frequency up to 10 kHz on a super-hydropobic teflon coated silicon wafer. Also continuous line width can be reduced to 20 microns on a hydrophobic surface.
  • Keywords
    coatings; electrohydrodynamics; elemental semiconductors; glass; hydrophobicity; ink jet printing; jets; nozzles; silicon; DC bias voltage; EHD; Si; batch fabrication; carbon black ink; continuous line width; electric field; glass nozzle; glass wafer; hydrophobic surface; jetting; multinozzle electrohydrodynamic inkjet printing head; sand blasting; separated dot pattern; size 100 micron; size 20 micron; size 30 micron; superhydropobic teflon coated silicon wafer; velocity 500 mm/s; voltage 1.7 kV; Electrohydrodynamics; Etching; Fabrication; Glass; Ink; Printing; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
  • Conference_Location
    Taipei
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4673-5654-1
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2013.6474458
  • Filename
    6474458