A collaborative design from schematic to layout: Based on MCP technology

With the rapid development of electronics technology, the technology continues to be miniaturization, multi-functionality, high bandwidth and low power consumption. System integration becomes more and more important. Multi-chip package (MCP) technology is one of the advanced technologies for system integration. A system or subsystem contains two-dimensional spaced multi-chips and a mass of passive components can be integrated into one single package using MCP technology. In this paper, there are four wire bond (WB) based bare chips and many passive components such as resistors and capacitors. To reduce the dimension of system, the MCP technology was used. Because of the complex of the system, a collaborative design process is necessary. It includes schematic design, layout and routing, design for manufacturability (DFM) and design for testability (DFT). In order to test the performance of the package, a test board was designed and manufactured.