• DocumentCode
    3501635
  • Title

    Research on microsystem interposer designer software with through silicon via

  • Author

    Yanzhu Lv ; Min Miao ; Xiaofei Wang ; Huifen Liu ; Xin Sun ; Zhensong Li ; Yuexia Zhang ; Xiaoqing Zhang

  • Author_Institution
    Inf. Microsyst. Inst., Beijing Inf. Sci. & Technol. Univ., Beijing, China
  • fYear
    2012
  • fDate
    13-16 Aug. 2012
  • Firstpage
    137
  • Lastpage
    141
  • Abstract
    This paper introduces the research and development of Interposer Designer© software for microsystem interposer designing. First, An algorithm that screen coordinate is converted to OpenGL coordinate is presented. The algorithm allows the user to draw cube, cylinder, hollow cube, hollow cylinder and other basic graphics elements for Si Interposer with the mouse, handling them in any position of the space. The development platform of Interposer Designer is Microsoft Visual C++6.0 and OpenGL. Designers can draw 2D or 3D interposer model through two ways, basic graphics operation or inputting interposer model parameters. Then, the function of software to extract the equivalent circuit model of the interposer model and output the RLC parameters are explained. The software may give output in .csv format.
  • Keywords
    C++ language; RLC circuits; Visual BASIC; electronic engineering computing; elemental semiconductors; equivalent circuits; integrated circuit design; micromechanical devices; silicon; three-dimensional integrated circuits; .csv format; 2D interposer model; 3D interposer model; Microsoft Visual C++6.0; OpenGL coordination; RLC parameter; Si; equivalent circuit; hollow cube; hollow cylinder; microsystem interposer designer software; research and development; screen coordinate conversion; through silicon via; Graphics; Integrated circuit modeling; Machine vision; Mice; Software; Solid modeling; Through-silicon vias; Si Interposer; TSV; coordinate convertion algorithm;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    978-1-4673-1682-8
  • Electronic_ISBN
    978-1-4673-1680-4
  • Type

    conf

  • DOI
    10.1109/ICEPT-HDP.2012.6474586
  • Filename
    6474586