Environmentally harmonized plasma etching process using laser ablation of various solid materials

Polytetrafluoroethylene (PTFE) and polyvinylidenenefloride (PVDF) were selected as solid materials. PTFE and PVDF are fluorocarbon material ([CF/sub 2/-CF/sub 2/],) and hydrofluorocarbon materials ([CF/sub 2/-CH/sub 2/],), respectively. We have investigated the fluorocarbon species generated from the solid material using a quadrupole mass spectrometry (QMS) and the behaviors of CF/sub x/ (x=1-3) radicals in the environmentally harmonized ECR plasma system using an infrared diode laser absorption spectroscopy (IRLAS). Moreover, the radical composition in the case of PTFE ablation were compared with that in the case of PVDF ablation. On the basis of these measurement results, this process was successfully applied to the selective etching of SiO/sub 2/ over Si.