Research on shear creep properties of SAC305 solder bumps in ball grid array

Author

Wenfei Zhang ; Bing An ; Wei Guo ; Shen Chai ; Yiping Wu

Author_Institution

Wuhan Nat. Lab. of Optoelectron., Wuhan, China

fYear

2012

fDate

13-16 Aug. 2012

Firstpage

909

Lastpage

913

Abstract

In this work, shear creep tests for the ball grid array specimens with the diameter of 0.6 mm Sn-3Ag-0.5Cu (SAC305) solder bumps have been conducted at various temperatures (60 °C, 80 °C and 100 °C) and stress levels (7 Mpa, 12 Mpa and 14 MPa) to determine its creep properties. The effects of stress level and temperature on creep strain rate were investigated. Creep constitutive equation of the steady-state creep, together with its stress exponent n, creep activation energy Q and structure constant A were determined by employing the power law creep. The analysis result of the ANSYSTM finite-element analysis software was accordant with the expectation. Compared with specimen with 760 mm, a fairly good agreement in creep behavior could be found.

Keywords

ball grid arrays; creep testing; finite element analysis; shear strength; solders; stress effects; temperature; tin alloys; ANSYSTM finite-element analysis software; SAC305 solder bumps; SnAgCu; ball grid array specimens; creep activation energy; creep behavior; creep constitutive equation; creep strain rate; power law creep; shear creep property; shear creep tests; steady-state creep; stress exponent; stress level effects; stress levels; structure constant; temperature effects; Abstracts; Computational modeling; Computers; Creep; Stress; Stress measurement; Weight measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on

Conference_Location

Guilin

Print_ISBN

978-1-4673-1682-8

Electronic_ISBN

978-1-4673-1680-4

Type

conf

DOI

10.1109/ICEPT-HDP.2012.6474756

Filename

6474756