Ceramic column grid array: A high-reliability approach for area array packaging

Author

Yingzhuo Huang ; Xueming Jiang ; Pengrong Lin ; Yusheng Cao ; Binhao Lian ; Quanbin Yao

Author_Institution

Beijing Microelectron. Technol. Inst., Beijing, China

fYear

2012

fDate

13-16 Aug. 2012

Firstpage

930

Lastpage

933

Abstract

Ceramic column grid array (CCGA) package is an extension of the ceramic ball grid array (CBGA) package. The CCGA uses a column instead of a high melt ball to create a higher standoff and more flexible interconnect, and to achieve a significant increase in reliability. This paper introduced a technology of CCGA package with LGA717 substrate, it specifically discussed the coplanarity, the void rate and the solder joint strength. By design of the daisy-chain substrate, the board-level reliability of the CBGA and CCGA packages were investigated. The CCGA components had longer life than that of the CBGA components.

Keywords

ceramic packaging; reliability; solders; CCGA components; CCGA package; LGA717 substrate; area array packaging; board-level reliability; ceramic column grid array package; daisy-chain substrate; flexible interconnect; high-reliability approach; solder joint strength; Abstracts; Commercialization; Cooling; Joints; Packaging; Reliability; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on

Conference_Location

Guilin

Print_ISBN

978-1-4673-1682-8

Electronic_ISBN

978-1-4673-1680-4

Type

conf

DOI

10.1109/ICEPT-HDP.2012.6474760

Filename

6474760