DocumentCode
3505925
Title
Critical variables in gaseous corrosion testing
Author
Jeannotte, Dexter ; Biyani, Shriram ; Roth, John ; Hall, Larry ; Davies, Sue ; Vaughen, Bruce ; Steppan, James
Author_Institution
IBM, Hopewell Junction, NY, USA
fYear
1988
fDate
26-29 Sept. 1988
Firstpage
321
Lastpage
325
Abstract
In recent work at Vanderbilt University, a failure mode was characterized that is accelerated by the presence of hostile gases in the environment. The effect of the velocity of the hostile gas stream was tested. Three different gas velocities were evaluated by measurement of the time of development of a shorting failure over a range of electrical field strengths. It was found that the time to failure decreased in proportion to the square root of the gas velocity as velocity increased in the range of 4 mm/s to 400 mm/s. The electrolyte base was provided by a coating of polyethylene glycol, average molecular weight 400, PEG400, between the Cu electrodes. These results make it possible to relate the time to failure to application variables such as gas concentration and gas-flow velocity, thus making possible at estimate of product lifetime from test results.<>
Keywords
copper; corrosion testing; electronic equipment testing; life testing; 4 to 400 mm/s; Cu electrodes; PEG400; SO/sub 2/ gas; Vanderbilt University; accelerated testing; air velocity; application variables; coating of polyethylene glycol; critical variables; electrolyte base; electrolytic metal migration; estimate of product lifetime; failure mode; gas concentration; gas test chamber; gas-flow velocity; gaseous corrosion testing; hostile gases; molecular weight 400; range of electrical field strengths; reliability; shorting failures; test results; Acceleration; Coatings; Corrosion; Electric variables measurement; Electrodes; Gases; Polyethylene; Testing; Time measurement; Velocity measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Contacts, 1988., Proceedings of the Thirty Fourth Meeting of the IEEE Holm Conference on
Conference_Location
San Francisco, CA, USA
Type
conf
DOI
10.1109/HOLM.1988.16134
Filename
16134
Link To Document