Plasma polymerization of methyl methacrylate: a photoresist for 3D applications

Author

Guckel, H. ; Uglow, J. ; Lin, M. ; Denton, D. ; Tobin, J. ; Euch, K. ; Juda, M.

Author_Institution

Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA

fYear

1988

fDate

6-9 June 1988

Firstpage

9

Lastpage

12

Abstract

The use of plasma polymerized methyl methacrylate (PPMMA) as a deep UV photoresist is described. By depositing a light sensitive polymer film from a plasma, very irregular surfaces can be coated and patterned. Other key parameters for a photoresist are photosensitivity, stability, selectivity, and resolution. These parameters are used here as a means of optimizing the plasma process, exposure, and development cycle. The optimum process sequence results in stable films which withstand subsequent exposure to acetone and isopropyl alcohol, have a line width resolution of at least 1.5 mu m, and have a selectivity of at least 70%.<>

Keywords

photoresists; plasma applications; polymer films; polymerisation; 1.5 micron; 3D applications; PMMA; acetone; deep UV photoresist; isopropyl alcohol; light sensitive polymer film; photosensitivity; plasma polymerized methyl methacrylate; selectivity; stability; stable films; Fabrication; Inductors; Instruments; Microelectronics; Plasma applications; Plasma materials processing; Plasma sources; Plasma stability; Polymer films; Resists;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensor and Actuator Workshop, 1988. Technical Digest., IEEE

Conference_Location

Hilton Head Island, SC, USA

Type

conf

DOI

10.1109/SOLSEN.1988.26420

Filename

26420