• DocumentCode
    3508065
  • Title

    Establishment of the coarse grained parameters for epoxy-copper interfacial separation

  • Author

    Wong, C.K.Y. ; Leung, Stanley Y. Y. ; Poelma, R.H. ; Jansen, K.M.B. ; Yuan, Cadmus C. A. ; van Driel, W.D. ; Guoqi Zhang

  • Author_Institution
    Dept. PME, Delft Univ. of Technol., Delft, Netherlands
  • fYear
    2012
  • fDate
    13-16 Aug. 2012
  • Firstpage
    1467
  • Lastpage
    1473
  • Abstract
    Atomistic coarse grained parameters were calculated from a non-equilibrium molecular dynamics simulation of the separation of an epoxy-copper interface. The methodology to determine the interaction energy and the equilibrium distance between the interfacial materials at a minimum energy is established. The traction-displacement relations of the separation under the influence of time taken for atomic interaction, displacement step, and molecular size have been studied. The study illustrates that the control of the time step in the molecular dynamics models is important to ensure a proper separation simulation. The result shows close matching with the thermodynamics work of adhesion. An analytical scheme to determine the coarse grained parameters from the relations is discussed. The proposed methodology contributes to the interpretation of interfacial adhesion beyond the continuum framework.
  • Keywords
    adhesion; copper; electronics packaging; molecular dynamics method; polymers; surface energy; atomic interaction; atomistic coarse grained parameter; displacement step; epoxy-copper interfacial separation; equilibrium distance; interaction energy; interfacial adhesion; interfacial material; minimum energy; molecular size; nonequilibrium molecular dynamics simulation; separation simulation; thermodynamics work; time step; traction-displacement relations; Abstracts; Adhesives; Atomic layer deposition; Copper; Fitting; Force; Materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    978-1-4673-1682-8
  • Electronic_ISBN
    978-1-4673-1680-4
  • Type

    conf

  • DOI
    10.1109/ICEPT-HDP.2012.6474884
  • Filename
    6474884