DocumentCode
3508065
Title
Establishment of the coarse grained parameters for epoxy-copper interfacial separation
Author
Wong, C.K.Y. ; Leung, Stanley Y. Y. ; Poelma, R.H. ; Jansen, K.M.B. ; Yuan, Cadmus C. A. ; van Driel, W.D. ; Guoqi Zhang
Author_Institution
Dept. PME, Delft Univ. of Technol., Delft, Netherlands
fYear
2012
fDate
13-16 Aug. 2012
Firstpage
1467
Lastpage
1473
Abstract
Atomistic coarse grained parameters were calculated from a non-equilibrium molecular dynamics simulation of the separation of an epoxy-copper interface. The methodology to determine the interaction energy and the equilibrium distance between the interfacial materials at a minimum energy is established. The traction-displacement relations of the separation under the influence of time taken for atomic interaction, displacement step, and molecular size have been studied. The study illustrates that the control of the time step in the molecular dynamics models is important to ensure a proper separation simulation. The result shows close matching with the thermodynamics work of adhesion. An analytical scheme to determine the coarse grained parameters from the relations is discussed. The proposed methodology contributes to the interpretation of interfacial adhesion beyond the continuum framework.
Keywords
adhesion; copper; electronics packaging; molecular dynamics method; polymers; surface energy; atomic interaction; atomistic coarse grained parameter; displacement step; epoxy-copper interfacial separation; equilibrium distance; interaction energy; interfacial adhesion; interfacial material; minimum energy; molecular size; nonequilibrium molecular dynamics simulation; separation simulation; thermodynamics work; time step; traction-displacement relations; Abstracts; Adhesives; Atomic layer deposition; Copper; Fitting; Force; Materials;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location
Guilin
Print_ISBN
978-1-4673-1682-8
Electronic_ISBN
978-1-4673-1680-4
Type
conf
DOI
10.1109/ICEPT-HDP.2012.6474884
Filename
6474884
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