Mechanical strength and interface characteristics of glass-to-glass laser bonding using glass frit

With the continuous improvement of the electron component integrating, the packet size and weight of micro electro-devices are continue shrinking. The convenient and low-temperature processing techniques are the trend of bonding techniques. Glass frit bonding technology has advantages which include a relatively low joining temperature, and less stringent requirements for contact surface smoothness. The laser bonding is widely used due to the advantages of non-connect, local heating and flexibility. Both of the techniques are applied in Micro Electro-Mechanical System (MEMS), modern electronic, electro-optic, and photovoltaic. In the paper, we investigated the influence of the copper oxide (CuO) fillers to laser energy absorbing by the glass frit. Three groups of glass frit with CuO ratios of 10%, 15% and 20% were researched. The characteristics of samples were evaluated. The mechanical strengths of bonded samples were tested by tensile stress gauges. The surface morphology of the films was observed by optical microscope and scanning electron microscope (SEM). The sheet resistance was measured by a resistivity meter. The results showed that the sheet resistance was complied with the requirements of low conductivity. The 15% CuO sample showed the better shear strength than the other two groups. The glass frit with 10%, 20% of CuO fillers exhibited poor features.