• DocumentCode
    350871
  • Title

    A study on logic design and architecture simulator design of a new on-chip multiprocessor

  • Author

    Woo-Jong Hahn ; Park, Kyong ; Choi, Song-Hoon ; Suk-Han Yoon

  • Author_Institution
    Dept. of Comput. Syst., ETRI, South Korea
  • Volume
    1
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    475
  • Abstract
    We propose a novel on-chip multiprocessor architecture and a program-driven simulator for the processor. Today´s superscalar processors already have very complicated control logics to resolve dependencies while increasing the instructions per-cycle (IPC). With the advent of semiconductor technology, integrating multiple processors into a chip is a promising alternative for increasing IPC. The new architecture simulator provides a coarse grain multithreaded architecture simulation environment. It runs various multithreaded benchmark programs. We can find out how various architecture-dependent parameters affect the behavior and performance of the on-chip multiprocessor as it includes not only the instruction set architecture but also the microarchitecture
  • Keywords
    logic CAD; microprocessor chips; multi-threading; multiprocessor interconnection networks; performance evaluation; virtual machines; architecture simulator; architecture simulator design; architecture-dependent parameters; coarse grain multithreaded architecture simulation environment; control logics; instruction set architecture; instructions per-cycle; logic design; microarchitecture; multiple processors; multithreaded benchmark programs; on-chip multiprocessor architecture; program-driven simulator; semiconductor technology; superscalar processors; Computational modeling; Computer architecture; Computer simulation; Delay; Hardware; Libraries; Logic design; Microarchitecture; System-on-a-chip; Yarn;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TENCON 99. Proceedings of the IEEE Region 10 Conference
  • Conference_Location
    Cheju Island
  • Print_ISBN
    0-7803-5739-6
  • Type

    conf

  • DOI
    10.1109/TENCON.1999.818454
  • Filename
    818454