DocumentCode
3510378
Title
Edge erosion effects in double sided silicon micromachining
Author
Zanini, M. ; Mikkor, M. ; Elder, R.C. ; Cathey, L.W. ; Bomback, J.L. ; Artz, B.E.
Author_Institution
Ford Motor Co., Dearborn, MI, USA
fYear
1988
fDate
6-9 June 1988
Firstpage
111
Lastpage
113
Abstract
The shape modifications observed on the edges of openings formed by a double-sided etch when etched past the breakthrough point are described. A method for predicting the overetching effects of such shapes is described. The implications that the results have on dimensional control of beams and orifices utilized in some micromachined silicon devices are also discussed. Orifices with relatively straight walls can be etched through
Keywords
elemental semiconductors; etching; semiconductor technology; silicon; wear; Si; cantilevers; cross sections; dimensional control of beams; double-sided etch; edge erosion; internal edges; micromachining; orifices; overetching effects; passivation layer; shape modifications; Anisotropic magnetoresistance; Crystallography; Micromachining; Microstructure; Orifices; Rough surfaces; Shape control; Silicon; Surface roughness; Wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensor and Actuator Workshop, 1988. Technical Digest., IEEE
Conference_Location
Hilton Head Island, SC, USA
Type
conf
DOI
10.1109/SOLSEN.1988.26451
Filename
26451
Link To Document