Parameter extraction for circuit models of electronic packages without optimization

Author

Martens, Luc ; Sercu, Stefaan

Author_Institution

Dept. of Inf. Technol., Ghent Univ., Belgium

fYear

1999

fDate

1999

Firstpage

71

Lastpage

74

Abstract

In this paper, we derive circuit models for electronic packages starting from Z- or Y-matrix descriptions. If we propose a T- or a Π-circuit, a direct relation is found between the admittance and impedance values and the circuit parameters. No optimization is needed. The T- and Π-circuit models are valid for a general class of interconnections and packages. We illustrate the method on an example of a TAB interconnection structure

Keywords

electric admittance; electric impedance; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; matrix algebra; network analysis; tape automated bonding; PI-circuit; T-circuit; TAB interconnection structure; Y-matrix description; Z-matrix description; admittance; circuit models; circuit parameters; electronic packages; impedance; interconnections; optimization; packages; parameter extraction; Admittance; Connectors; Electronics packaging; Frequency; Impedance; Information technology; Integrated circuit interconnections; Optimization methods; Parameter extraction; Pins;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1999

Conference_Location

San Diego, CA

Print_ISBN

0-7803-5597-0

Type

conf

DOI

10.1109/EPEP.1999.819196

Filename

819196