Electrical characterization of S/390 MCM packages from S-parameter measurements below 3 GHz

Author

Ktata, Faiez ; Arz, Uwe ; Grabinski, Hartmut

Author_Institution

Lab. fur Inf. Technol., Hannover Univ., Germany

fYear

1999

fDate

1999

Firstpage

75

Lastpage

78

Abstract

In this work, we investigate the electrical performance of critical signal paths in IBM S/390 MCM packages. We present lumped RLC-models suitable for standard circuit simulators operating in the time domain, e.g. SPICE. The models are developed from finite element simulations of typical signal path segments. By comparing S-parameters from simulations of the models to two-port network analyzer measurements, we validate the models in a frequency range up to 3 GHz

Keywords

S-parameters; SPICE; circuit simulation; finite element analysis; integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; lumped parameter networks; multichip modules; time-domain analysis; 3 GHz; IBM S/390 MCM packages; S-parameter measurements; S-parameters; SPICE; circuit simulators; critical signal paths; electrical characterization; electrical performance; finite element simulations; lumped RLC-models; models; signal path segments; simulations; time domain operation; two-port network analyzer measurements; Circuit simulation; Electric variables measurement; Finite element methods; Frequency measurement; Geometry; Integrated circuit interconnections; Packaging; Scattering parameters; Semiconductor device measurement; Semiconductor device modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1999

Conference_Location

San Diego, CA

Print_ISBN

0-7803-5597-0

Type

conf

DOI

10.1109/EPEP.1999.819197

Filename

819197