DocumentCode
3511159
Title
Radiated emission from pin-fin heat sink mounted on an EBGA package
Author
Qu, Pingyu ; Iyer, M.K. ; Qiu, Youlin
Author_Institution
Inst. of Microelectron., Singapore
fYear
1999
fDate
1999
Firstpage
199
Lastpage
202
Abstract
In this paper, radiated emissions from a commercial pin fin heat sink mounted on an EBGA package were studied. The effect of the pin length of the heat sink on the radiated field was analyzed. Finally, the mechanism of radiation enhancement was investigated, both from electromagnetic field and circuit points of view
Keywords
ball grid arrays; circuit simulation; electromagnetic field theory; electromagnetic interference; heat sinks; integrated circuit modelling; integrated circuit packaging; thermal management (packaging); EBGA package; electromagnetic field; heat sink; pin length; pin-fin heat sink; radiated emission; radiated field; radiation enhancement mechanism; Asia; Computational modeling; Computer simulation; Electronics packaging; Finite difference methods; Heat sinks; Microelectronics; Power dissipation; Resistance heating; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1999
Conference_Location
San Diego, CA
Print_ISBN
0-7803-5597-0
Type
conf
DOI
10.1109/EPEP.1999.819225
Filename
819225
Link To Document