Rapid resin mold with embedded thin film pressure/temperature sensors

Author

Luo, R.C. ; Lin, C.F. ; Chen, C.M. ; Chen, Y.S.

Author_Institution

Dept. of Electr. Eng., Nat. Chung Cheng Univ., Chia Yi, Taiwan

Volume

3

fYear

1999

fDate

1999

Firstpage

1301

Abstract

In this paper we have developed a new approach by embedding sensors into rapid resin mold´s core and cavity for directly measuring the pressure and temperature information for the purpose of improving the injection molding process. Using the information collected by embedded piezoelectric sensors, we can develop an on-line, close-loop control system to ensure the quality of products. We have simulated the system with time versus temperature for different mold materials

Keywords

closed loop systems; electric sensing devices; moulding; piezoelectric thin films; piezoelectric transducers; pressure measurement; pressure sensors; process control; temperature measurement; temperature sensors; thin film devices; embedded thin film sensors; injection molding process; on-line close-loop control system; piezoelectric sensors; pressure measurement; product quality control; rapid resin mold; temperature measurement; thin film pressure sensors; thin film temperature sensors; Injection molding; Piezoelectric films; Pressure measurement; Process control; Resins; Sensor phenomena and characterization; Sputtering; Temperature sensors; Thermal sensors; Thin film sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Industrial Electronics Society, 1999. IECON '99 Proceedings. The 25th Annual Conference of the IEEE

Conference_Location

San Jose, CA

Print_ISBN

0-7803-5735-3

Type

conf

DOI

10.1109/IECON.1999.819399

Filename

819399