Versatile low cost wafer level packaging enabled by powderblasting

A novel and highly cost-effective range of wafer level packaging schemes are presented for batch production across a heterogeneous spectrum of materials and applications. The enabling technology for these techniques is the development of accurate and repeatable wafer patterning processes using microabrasive powder blasting, supported by state of the art aligned wafer bonding technology. The combination of low-cost, material independent wafer-patterning, electroplating and aligned wafer bonding (eutectic, anodic, glass frit, and low temperature direct bonding) offers the benefits of wafer level packaging to low-volume, R&D, batch, and bridge-to- manufacture applications. Material and process flexibility enables implantable, CMOS, wafer- and chip-to-wafer packaging.