Ni underlayer efficiency investigation for whisker mitigation in IC packaging

Author

Lee, Jeffrey ChangBing

Author_Institution

IST-Integrated Service Technol., Hsinchu

fYear

2008

fDate

1-4 Sept. 2008

Firstpage

453

Lastpage

458

Abstract

In the study, the Ni underlayer plus matt Sn plated packages in PLCC, PDIP and LQFP were subject to SnAgCu and SnPb surface mounting and wave soldering respectively on the PCB with OSP surface finish, then followed by TCT (-55 to 85) 1000 cycle, THT (60 /90%RH) 3000 hrs to investigate whisker growth propensity. The practical whisker performance confirmation on the PCB beyond reflow simulation and component level was concluded to understand the Sn whisker potential in term of Ni underlayer efficiency. Additionally, various Sn thickness over Ni layer in package level was also applied to explore the Sn thickness effect on the whisker growth over TCT.

Keywords

integrated circuit packaging; nickel; printed circuits; silver compounds; soldering; surface mount technology; tin compounds; IC packaging; LQFP; Ni; OSP surface finish; PCB; PDIP; PLCC; SnAgCu; SnPb; TCT; component level; plated packages; reflow simulation; surface mounting; underlayer efficiency investigation; wave soldering; whisker mitigation; Electronics packaging; Environmentally friendly manufacturing techniques; Integrated circuit packaging; Lead; Packaging machines; Soldering; Surface finishing; Surface waves; Testing; Tin; Matt Sn plating; Ni underlayer; Surface mounting; TCT; THT; Whisker;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd

Conference_Location

Greenwich

Print_ISBN

978-1-4244-2813-7

Electronic_ISBN

978-1-4244-2814-4

Type

conf

DOI

10.1109/ESTC.2008.4684390

Filename

4684390