• DocumentCode
    3515956
  • Title

    Fabrication of Ag micromaterials by utilizing stress-induced migration

  • Author

    Saka, M. ; Yasuda, M. ; Tohmyoh, H. ; Settsu, N.

  • Author_Institution
    Dept. of Nanomech., Tohoku Univ., Sendai
  • fYear
    2008
  • fDate
    1-4 Sept. 2008
  • Firstpage
    507
  • Lastpage
    510
  • Abstract
    Silver micromaterials are highly prospected for modern electronic industries, especially due to their high electrical conductivity. Up to now, the formation of Ag nanowires that has been reported is based on chemical techniques. The processes of the chemical techniques are sophisticated, but somewhat complicated. On the other hand, a physical technique for fabricating metallic nanowires in a simple and controlled way by utilizing stress-induced migration has recently been reported. In this approach, it is recognized that the gradient of compressive hydrostatic stress might be the driving force for atomic diffusion. In the technique utilizing stress-induced migration, heating is required and oxide layer is necessary for fabrication of nano/micro materials. When Ag is heated, the key material, namely the oxide layer, decomposes at high temperature. In the present paper, an approach for fabrication of Ag nano/micro materials based on stress-induced migration is proposed, in which SiO2 layer is used as a passivation layer to overcome the drawback of the oxide layer.
  • Keywords
    diffusion; heat treatment; internal stresses; microfabrication; nanofabrication; nanowires; silicon compounds; silver; Ag-SiO2; atomic diffusion; compressive hydrostatic stress; heating; nanowires; passivation layer; silver micromaterials; stress-induced migration; Atomic layer deposition; Chemical processes; Compressive stress; Conductivity; Electronics industry; Fabrication; Heating; Nanowires; Silver; Stress control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
  • Conference_Location
    Greenwich
  • Print_ISBN
    978-1-4244-2813-7
  • Electronic_ISBN
    978-1-4244-2814-4
  • Type

    conf

  • DOI
    10.1109/ESTC.2008.4684400
  • Filename
    4684400