DocumentCode
3516374
Title
Overview of Carbon Nanotubes as off-chip interconnects
Author
Xia Zhang ; Teng Wang ; Liu, Jiangchuan ; Andersson, Cristina
Author_Institution
Minist. of Educ.&SMIT Center, Shanghai Univ., Shanghai
fYear
2008
fDate
1-4 Sept. 2008
Firstpage
633
Lastpage
638
Abstract
Carbon nanotubes (CNTs) have drawn a lot of attention due to a combination of extraordinary properties and a wide range of potential applications. Due to the large potentials in satisfying future large scale integrated circuit requirements, much effort has been focused on the study of CNTs as on-chip interconnects. Combined with other conventional materials, CNTs are also promising alternatives for off-chip interconnect applications. The area of CNTs as off-chip interconnects has, currently, attracted a large research interest from both academia and industry. This paper presents an overview of the research work performed on CNTs based electronics. This review also covers the recent work performed on the development of CNTs as off-chip interconnects including both the advances in aligned CNTs bundles synthesis as well CNTs transfer technology. In addition, some challenges facing CNTs implementation in electronic industry are also addressed. The present overview is limited to the fundamental characteristics of CNTs as off-chip interconnects.
Keywords
carbon nanotubes; integrated circuit interconnections; CNT transfer technology; carbon nanotubes; off-chip interconnects; Bonding; Carbon nanotubes; Conducting materials; Electrons; Integrated circuit interconnections; Large scale integration; Mechanical factors; Thermal conductivity; Thermal factors; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location
Greenwich
Print_ISBN
978-1-4244-2813-7
Electronic_ISBN
978-1-4244-2814-4
Type
conf
DOI
10.1109/ESTC.2008.4684425
Filename
4684425
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