• DocumentCode
    3517862
  • Title

    Pulsed stress behavior of flexible thick film resistors

  • Author

    Bonfert, D. ; Wolf, H. ; Gieser, H. ; Klink, G. ; Bock, K. ; Svasta, P. ; Ionescu, C.

  • Author_Institution
    Fraunhofer Inst. Reliability & Microintegration, IZM-M, Munich
  • fYear
    2008
  • fDate
    1-4 Sept. 2008
  • Firstpage
    1179
  • Lastpage
    1184
  • Abstract
    In order to investigate the behavior for very high current densities on polymer resistors on flexible substrates, a pulsed measurement technique was applied. The analytical test technique of transmission line pulsing (TLP) allows, on the basis of square pulses, the in-situ monitoring of the voltages and currents at the device under test (DUT) during pulsing and helps to gain fundamental insights into the electrical behavior at higher current densities. The influence of the pulse amplitude on the current-voltage behavior was investigated on thick film carbon-based polymer resistors on flexible foil, like polyimide (Kapton). The resistance change due to an applied high voltage pulse stress is a measure of the ESD susceptibility of the thick film polymer resistors. The measurements show that the thick film flexible, carbon based resistors on Kapton foil are susceptible to high energy pulses. Parametric failure or catastrophic damage can occur.
  • Keywords
    conducting polymers; current density; electrostatic discharge; flexible electronics; thick film resistors; ESD susceptibility; current densities; current-voltage behavior; flexible foil; flexible substrates; flexible thick film resistors; in-situ monitoring; polyimide Kapton; polymer resistors; pulsed stress; square pulses; thick film carbon-based polymer resistors; thick film polymer resistors; transmission line pulsing; Current density; Electrical resistance measurement; Polymer films; Pulse measurements; Resistors; Stress; Testing; Thick films; Thickness measurement; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
  • Conference_Location
    Greenwich
  • Print_ISBN
    978-1-4244-2813-7
  • Electronic_ISBN
    978-1-4244-2814-4
  • Type

    conf

  • DOI
    10.1109/ESTC.2008.4684520
  • Filename
    4684520