• DocumentCode
    3517984
  • Title

    Indoor Analogue Tests for High Temperature Heat Pump and Its Industrial Application

  • Author

    Song, Yongchen ; Yang, Wenzhe ; Wang, Zhiguo ; Xiang, Xinyao

  • Author_Institution
    Coll. of Energy & Power Eng., Dalian Univ. of Technol., Dalian, China
  • fYear
    2010
  • fDate
    26-27 June 2010
  • Firstpage
    28
  • Lastpage
    33
  • Abstract
    For the facts that lots of low-temperature waste heat from industries (such as oil plants, chemical plants, power plants or steel plants) is abundant but rarely used, a series of analogue tests are conducted by using indoor high-temperature heat pump set-up. According to the tested data and results, the empirical expressions of all performance indexes are regressed under the condition of using R142b as refrigerant, heat source temperature at 35~45°C, heating temperature at 60~85°C, and compressor output at 2.3~3.7kw. Also the impact of parametric variations on performance indexes is analyzed. Furthermore, an engineering trial is performed by an industrial heat pump abroad operating in oil field. The investigations indicate that massive energy can be saved if heat pump is applied to recover the low temperature waste heat discharged from oil production process. But the operating cost of heat pump system is nearly the same as that of heater system in practical operation. This restricts the popularization of heat pump in oil field.
  • Keywords
    heat pumps; heating; oil technology; petroleum industry; refrigerants; R142b refrigerant; heat source temperature; heating temperature; high-temperature heat pumps; indoor analogue tests; oil field; oil production process; temperature 35 degC to 45 degC; temperature 60 degC to 85 degC; waste heat discharge; Analogue test; Engineering application; High temperature heat pump; Performance analysis; Waste heat recovery;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Future Power and Energy Engineering (ICFPEE), 2010 International Conference on
  • Conference_Location
    Shenzhen
  • Print_ISBN
    978-1-4244-7378-6
  • Electronic_ISBN
    978-1-4244-7379-3
  • Type

    conf

  • DOI
    10.1109/ICFPEE.2010.15
  • Filename
    5663340