• DocumentCode
    3518168
  • Title

    PTC temperature sensors on curved LTCC–layers

  • Author

    Weilguni, Michael ; Medek, Robert ; Smetana, Walter ; Kausel, Wilfried

  • Author_Institution
    Inst. of Sensor & Actuator Syst., Vienna TU, Vienna, Austria
  • fYear
    2010
  • fDate
    12-16 May 2010
  • Firstpage
    99
  • Lastpage
    102
  • Abstract
    To carry out studies on the warming-up of wind instruments, temperature sensors are required that exactly fit into the tube of the instrument. A PTC (positive temperature coefficient) temperature sensor was developed in LTCC (low temperature co-fired ceramics) technology, solving this problem. To keep the overall design small, a very simple geometry was used that just consists of one ceramic tape layer with PTC resistor and 4-wire connection pads on top. The PTC sensor was laminated around a rod and sintered inside a pipe to achieve the desired curvature. Various different ceramic tape materials were used and the electrical properties of the PTC sensor were measured with respect to varying curvature (flat, diameter 12 mm and 18 mm) where resistor elements were positioned in both axial and radial orientation. Finally, the results were obtained by usage of CeramTec GC tape, ESL PTC26xx-I PTC-paste and ESL 9695-G conductor paste. The curvature showed no influence on the TCR (resistive temperature coefficient). The resistance of the curved resistors in axial as well as radial orientation was lower compared to the flat structure.
  • Keywords
    ceramics; resistors; tape casting; temperature sensors; CeramTec GC tape; ESL 9695-G conductor paste; ESL PTC26xx-I PTC-paste; PTC resistor; PTC temperature sensor; ceramic tape layer; curved LTCC-layer; low temperature co-fired ceramic; positive temperature coefficient; size 12 mm; size 18 mm; wind instrument warming-up; Conductivity; Instruments; Resistors; Springs; Temperature distribution; Temperature measurement; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology (ISSE), 2010 33rd International Spring Seminar on
  • Conference_Location
    Warsaw
  • Print_ISBN
    978-1-4244-7849-1
  • Electronic_ISBN
    978-1-4244-7850-7
  • Type

    conf

  • DOI
    10.1109/ISSE.2010.5547268
  • Filename
    5547268