• DocumentCode
    3518339
  • Title

    Logic-Based Mega-Bit CuxSiyO emRRAM with Excellent Scalability Down to 22nm Node for post-emFLASH SOC Era

  • Author

    Wang, Yanliang ; Yang, Lingming ; Wang, Ming ; Luo, Wenjin ; Hu, Beiyuan ; Lin, Yinyin ; Huang, Ryan ; Zou, Qingtian ; Wu, Jingang

  • Author_Institution
    Dept. Microelectron., Fudan Univ., Shanghai, China
  • fYear
    2011
  • fDate
    22-25 May 2011
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Excellent scalability of a novel CuxSiyO emRRAM down to 22 nm node is demonstrated based on statistical data of 1 Mb test chip for the first time. The integration utilizes the standard logic process and the RRAM size is shrunk by spacer pattern technology. The reset current decreases by 5X from 130nm to 22nm node with maintaining robust data retention (10yrs. @150°C), good resistance distribution (with 10X window @125°C), significant read disturbance immunity (after 1010 cycles @0.5V, 50ns pulse), acceptable fast speed (set 100ns; reset 60us), and competitive cost effectiveness (no dedicated tools). This solution is promising in the advanced logic node for SOC applications of post-emFLASH era.
  • Keywords
    copper compounds; flash memories; integrated circuit reliability; random-access storage; silicon compounds; system-on-chip; CuxSiyO; logic-based mega-bit emRRAM; post-emFLASH SOC; read disturbance immunity; resistance distribution; robust data retention; size 130 nm to 22 nm; spacer pattern technology; statistical data; storage capacity 1 Mbit; Arrays; Copper; EPROM; Resistance; Scalability; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Memory Workshop (IMW), 2011 3rd IEEE International
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    978-1-4577-0225-9
  • Electronic_ISBN
    978-1-4577-0224-2
  • Type

    conf

  • DOI
    10.1109/IMW.2011.5873218
  • Filename
    5873218