DocumentCode
3518410
Title
Mechanisms of dynamic pass leakage current in partially depleted SOI MOSFETs
Author
Saraya, T. ; Hiramoto, T.
Author_Institution
Inst. of Ind. Sci., Tokyo Univ., Japan
fYear
1999
fDate
4-7 Oct. 1999
Firstpage
84
Lastpage
85
Abstract
The floating body effect is one of the most serious problems for applications of partially depleted (PD) SOI MOSFETs. In particular, the dynamic pass leakage caused by the floating body effect (Assaderaghi et al., 1996) degrades retention time in SOI DRAMs (Kim et al., 1996) and produces timing errors in dynamic circuits (Canada et al., 1999). Two mechanisms have been considered so far as the origin of dynamic pass leakage: (1) parasitic bipolar current (Assaderaghi et al., 1997; Wei and Antoniadis, 1996) and (2) subthreshold current (Kim et al., 1996; Morishita et al., 1995), as shown here, taking SOI DRAM cells as an example. However, no experimental data have been reported that distinguish between these two currents, and the mechanism of the dynamic pass leakage has not been reported. In this paper, the parasitic bipolar current and subthreshold current have been successfully separated in the transient measurements and the origin of the dynamic pass leakage has been clarified, to our knowledge, for the first time.
Keywords
DRAM chips; MOSFET; leakage currents; semiconductor device measurement; silicon-on-insulator; timing; transient analysis; SOI DRAM cells; SOI DRAMs; Si-SiO/sub 2/; data retention time; dynamic circuits; dynamic pass leakage; dynamic pass leakage current mechanisms; floating body effect; parasitic bipolar current; partially depleted SOI MOSFETs; subthreshold current; timing errors; transient measurements; Current measurement; Leakage current; MOSFETs; Power system transients; Pulse measurements; Random access memory; Subthreshold current; Time measurement; Transmission line measurements; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference, 1999. Proceedings. 1999 IEEE International
Conference_Location
Rohnert Park, CA, USA
ISSN
1078-621X
Print_ISBN
0-7803-5456-7
Type
conf
DOI
10.1109/SOI.1999.819864
Filename
819864
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