Packaging and thermal analysis of power electronics modules

The Intermediate Data Format (IDF) is a specification designed to provide a neutral representation for exchanging printed circuit assembly (PCA) data among mechanical design (MCAD), PCA layout (ECAD), and physical design analysis (MCAE) applications. Powerful analysis software, like Ansys, Maxwell, Semcad, Altium Designer or SolidWorks - CircuitWorks, can import the idf files and use the model for electromagnetic or thermal analysis. The information can also be used for a mechanical approach point of view. The paper will present a combined analysis - starting from electrical design, then the 3D model, thermal and mechanical approach of the PCB Layout for a relative humidity and temperature controller as a case study.