• DocumentCode
    3518780
  • Title

    A multilayer low pass filter fabricated by ferrite and ceramic cofiring system based on LTCC technology

  • Author

    Li, Yuanxun ; Liu, Yingli ; Zhang, Huaiwu ; Han, Likun ; Yang, Zongbao

  • Author_Institution
    State Key Lab. of Electron. Thin Film & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2009
  • fDate
    10-13 Aug. 2009
  • Firstpage
    961
  • Lastpage
    964
  • Abstract
    LTCC (Low Temperature Co-fired Ceramics) has been become the key technology of packaging for the integrated of passive components due to its higher performance of thermal sink, reliability and plays an important role in increasing higher frequency, decreasing the loss, minimize the volume, etc. This paper mainly focuses on the design and fabrication of low pass filter based on ferrite and ceramic cofiring system by LTCC technology. Firstly, the match conditions of co-firing characteristics for ferrite and ceramic cofiring system were carefully studied by TMA measurement and the excellent shrinkage controlling was obtained. The low-pass filters with cut-off frequency at 120 MHz were fabricated using Co/Ti doped barium ferrite and ULF140 material as the dielectrics to further validate the circuit model and the samples were tested with high consistence with the simulated data.
  • Keywords
    barium compounds; ceramic packaging; cobalt; ferrite filters; heat sinks; low-pass filters; multilayers; thermal analysis; titanium; BaFe2O4:Co,Ti; LTCC technology; TMA measurement; ferrite-and-ceramic cofiring system; low-temperature co-fired ceramics; multilayer low pass filter fabrication; passive components; thermal sink; Ceramics; Circuit testing; Fabrication; Ferrites; Frequency; Low pass filters; Nonhomogeneous media; Packaging; Performance loss; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-4658-2
  • Electronic_ISBN
    978-1-4244-4659-9
  • Type

    conf

  • DOI
    10.1109/ICEPT.2009.5270565
  • Filename
    5270565