• DocumentCode
    3518798
  • Title

    Research of SMT product assembly quality management system based on J2EE

  • Author

    Zhao, Huihuang ; Zhou, Dejian ; Wu, Zhaohua ; Cheng, Xiaoyong

  • Author_Institution
    Sch. of Mechano-Electron. Eng., Xidian Univ., Xi´´an, China
  • fYear
    2009
  • fDate
    10-13 Aug. 2009
  • Firstpage
    965
  • Lastpage
    969
  • Abstract
    SMT product assembly quality management system structure and content is designed, according to its characteristics and requirements. A developing method of SMT product assembly quality management system is proposed based on J2EE, in order to improve its reusability, portability and expansibility. An integrated architecture which consists of Struts, Spring and Ibatis is designed based on lightweight framework. Then the integrated architecture is used to develop the SMT product assembly quality management system. During the integrated architecture, Struts is used in presentation layer, Spring is used in business layer and Ibatis is used in persistence layer. The process and implementation of this management system of a function module are introduced. The analysis results have shown that the SMT product assembly quality management system based on J2EE has some advantages in reusability, portability and expansibility.
  • Keywords
    Java; assembling; quality management; surface mount technology; Ibatis; J2EE; SMT product assembly quality management system; Spring; Struts; business layer; expansibility; persistence layer; portability; presentation layer; reusability; surface mount technology; Assembly systems; Control systems; Databases; Design engineering; Java; Production systems; Quality management; Software performance; Software quality; Surface-mount technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-4658-2
  • Electronic_ISBN
    978-1-4244-4659-9
  • Type

    conf

  • DOI
    10.1109/ICEPT.2009.5270566
  • Filename
    5270566