• DocumentCode
    3518998
  • Title

    Investigation of mechanism for spontaneous zinc whisker growth from an electroplated zinc coating

  • Author

    Baated, Alongheng ; Kim, Keun-Soo ; Suganuma, Katsuaki

  • Author_Institution
    Grad. Sch. of Eng., Osaka Univ., Suita, Japan
  • fYear
    2009
  • fDate
    10-13 Aug. 2009
  • Firstpage
    1019
  • Lastpage
    1022
  • Abstract
    Zinc (Zn) whiskers are tiny hair-like electrically conductive filaments of Zn that sometimes grow from Zn coated surfaces (e.g., electroplated, hot dip). Zn coatings are commonly used as anti-corrosion coatings for iron (Fe) based structures. One of many common applications for Zn coated Fe is found on raised-floor tiles and support structures utilized in computer data centers. The formation of Zn whiskers threatens the reliable operation of electronic equipments due to the electrical shorting hazard they present. As with tin whiskers (much more broadly researched than Zn whiskers), the mechanism of formation is still not clear. This work investigated the Zn whisker growth mechanism for an electroplated Zn coating above carbon steel substrate from a raised floor tile using recent technology methods. Iron-zinc (Fe-Zn) Intermetallics and Zn oxides were identified by X-ray diffraction analysis (XRD). EDS (energy disperse spectroscopy) and EPMA (electron probe micro analysis) identified Fe-Zn intermetallic compounds on the surface of the Zn layer in addition to the interface between Zn coating and carbon steel substrate. Zn oxides formed primarily on the surface of Zn coating. Consequently, we speculate that Fe-Zn intermetallic compounds and Zn oxide formation can be the source of compressive stress effect on Zn whiskers growth on electroplated Zn coating above carbon steel substrate.
  • Keywords
    X-ray chemical analysis; X-ray diffraction; electroplated coatings; whiskers (crystal); zinc; X-ray diffraction analysis; Zn; electrically conductive filaments; electron probe micro analysis; electroplated zinc coating; energy disperse spectroscopy; spontaneous zinc whisker growth; Application software; Carbon compounds; Coatings; Electronic equipment; Hazards; Intermetallic; Iron; Steel; Tiles; Zinc;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-4658-2
  • Electronic_ISBN
    978-1-4244-4659-9
  • Type

    conf

  • DOI
    10.1109/ICEPT.2009.5270576
  • Filename
    5270576