DocumentCode
351961
Title
Thermal testing: fault location strategies
Author
Altet, Josep ; Rubio, Antonio ; Schaub, E. ; Dialhaire, S. ; Claeys, W.
Author_Institution
Dept. of Electron. Eng., Univ. Politecnica de Catalunya, Barcelona, Spain
fYear
2000
fDate
2000
Firstpage
189
Lastpage
193
Abstract
By measuring the temperature at some points of an IC during a test procedure, defects can be detected (fault testing). With a simple processing of the measured temperature waveform, the distance between the temperature monitoring point and the activated defect can be derived. This paper presents four temperature measuring strategies to determine this distance for diagnosis purposes
Keywords
fault diagnosis; goniometers; integrated circuit measurement; integrated circuit testing; IC test procedure; activated defect; fault diagnosis purposes; fault location strategies; temperature measurement; temperature monitoring point; temperature waveform; thermal testing; Circuit testing; Fault location; Integrated circuit testing; Phase measurement; Remote monitoring; Silicon; Temperature measurement; Temperature sensors; Thermal resistance; Time measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Test Symposium, 2000. Proceedings. 18th IEEE
Conference_Location
Montreal, Que.
ISSN
1093-0167
Print_ISBN
0-7695-0613-5
Type
conf
DOI
10.1109/VTEST.2000.843844
Filename
843844
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