Developing on IC flip chip bonder machine & process

Flip chip bonding process is a new solution for nowadays IC production. Since of small amount & much kinds of IC types, evenly to much package process, it also needs a flexible machine who can deal with many requirements in lower cost and quickly response. The MFC108 is new designed flip chip bonder for above demands. In this paper, the designing methods are also introduced. By the 3D software of mechanical designing, it spent fewer time to finish the function design with simulation that can be fount out almost all designing mistakes. On the electrical soft design, it is controlled the three kinds of parameters in the operators´ selection. The parameters are temperature, pressure and position. By the mixed process designed by users, MFC108 can finish the given bonding process. The machine bonding accuracy is plusmn5.