• DocumentCode
    3520383
  • Title

    Effect of split power/ground planes using stitching capacitors on radiated emission

  • Author

    Lee, Jang-Hoon ; Lee, Pil-Soo ; Lee, Tae-Heon ; Kim, ChangGyun ; Song, In-Chae ; Wee, Jae-Kyung

  • Author_Institution
    Sch. of Electron., Soongsil Univ., Seoul, South Korea
  • fYear
    2009
  • fDate
    9-11 Dec. 2009
  • Firstpage
    541
  • Lastpage
    545
  • Abstract
    In this paper, the radiated emissions generated by various split power/ground plane structures are studied. The magnetic field and electric field over the designed test pattern are simulated. Each of the results has different field pattern by bandwidth of signal frequency, gap space or gap location of the split ground gap. To reduce the radiated emission, the method for determining the gap space and the gap location are studied based on the return current distributions. Also, the magnetic near-fields are measured by the near field EMI scan over the test board with the different value and location of the stitching capacitors. These results show that the radiated emission on split power/ground structure can be reduced by optimizing its structure. Moreover, the values and locations of the stitching capacitor should be determined to minimize the discontinuity of the return current paths.
  • Keywords
    automatic test pattern generation; electromagnetic interference; integrated circuit design; integrated circuit noise; integrated circuit packaging; integrated circuit testing; EMI scan; designed test pattern; electric field; gap location; gap space; magnetic field; magnetic near fields; radiated emission; split power-ground planes; stitching capacitors; Capacitors; Circuit testing; Current distribution; Electromagnetic interference; Frequency; Magnetic analysis; Magnetic field measurement; Power generation; Space technology; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-5099-2
  • Electronic_ISBN
    978-1-4244-5100-5
  • Type

    conf

  • DOI
    10.1109/EPTC.2009.5416488
  • Filename
    5416488