DocumentCode
3520503
Title
Creep characterization of lead free 80Au-20Sn solder
Author
Su, Fei ; Pan, Haiyan
Author_Institution
Inst. of Solid Mech., Beijing Univ. of Aeronaut. & Astronaut., Beijing, China
fYear
2009
fDate
10-13 Aug. 2009
Firstpage
718
Lastpage
721
Abstract
In this paper, steady-state creep behavior of lead free 80Au-20Sn solder was investigated at three different temperatures (i.e. 25degC, 75degC and 125degC) and a range of stress levels. Hyperbolic-Sine model was employed to characterize the creep properties of the lead free solder, constants in the model were determined through data fitting and were compared with that of other lead free solders.
Keywords
creep; gold alloys; hyperbolic equations; solders; stress analysis; tin alloys; AuSn; data fitting; hyperbolic-sine model; lead free solder alloys creep characterization; steady-state creep behavior; stress level range; temperature 125 C; temperature 25 C; temperature 75 C; Capacitive sensors; Creep; Electronic packaging thermal management; Environmentally friendly manufacturing techniques; Fatigue; Lead; Mechanical factors; Optical materials; Soldering; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-4658-2
Electronic_ISBN
978-1-4244-4659-9
Type
conf
DOI
10.1109/ICEPT.2009.5270656
Filename
5270656
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