Effect of Cu addition in sn-containing solder joints on interfacial reactions with Au foils

Author

Liu, Wei ; Wang, Chunqing ; Sun, Lining ; Tian, Yanhong ; Chen, Yarong

Author_Institution

Dept. of Electron. Packaging Technol., State Key Lab. of Adv. Welding Production Technol., China

fYear

2009

fDate

10-13 Aug. 2009

Firstpage

642

Lastpage

645

Abstract

Pure Sn, Sn-0.7Cu, Sn-1.5Cu and Sn-3.0Cu solder joints were fabricated by a laser reflow soldering method, and then they were aged at 125degC for various periods. After 600 hours treatment, we found that thickness of Intermetallic Compounds (IMCs) in the pure Sn solder joints was 54mum. However, in the solder joints with Cu addition, formation of AuSn₄ IMCs was inhibited, and other two kinds of Sn-Cu-Au ternary phases were found in stead. In the Sn-3.0Cu solder joints, the IMCs and phases were only 34mum in thickness, moreover, growth of the IMCs and phases did not follow the parabolic law.

Keywords

ageing; copper alloys; gold; reflow soldering; tin alloys; Au; SnCu; interfacial reactions; intermetallic compounds; laser reflow soldering; solder joints; temperature 125 degC; time 600 hour; Aging; Electronic equipment manufacture; Electronics packaging; Environmentally friendly manufacturing techniques; Gold; Isothermal processes; Lead; Metallization; Preforms; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-4658-2

Electronic_ISBN

978-1-4244-4659-9

Type

conf

DOI

10.1109/ICEPT.2009.5270672

Filename

5270672