• DocumentCode
    3521128
  • Title

    Preparation and properties of epoxy resin/silicone hybrids for electronic applications

  • Author

    Lee, Seon Suk ; Song, G.S. ; Lee, D.W. ; Kim, H.N. ; Kang, K.H. ; Lee, Dai Soo

  • Author_Institution
    Div. of Semicond. & Chem. Eng., Chonbuk Nat. Univ., Jeonju, South Korea
  • fYear
    2009
  • fDate
    9-11 Dec. 2009
  • Firstpage
    348
  • Lastpage
    351
  • Abstract
    Epoxy resin/silicone hybrids were synthesized through the cationic polymerization of a cycloaliphatic epoxy resin and a hydroxy-terminated poly(dimethyl siloxane) (PDMS) in different molar ratios. Molar ratios of the epoxy resin and silicone for the hybrids were 1/1, 1/0.75, 1/0.5, 1/0.25.3-Glycidoxypropyl-trimethoxysilane (GPTMS) was also added to the epoxy resin/silicone mixtures to improve the transparency by the reaction between GPTMS and the resin mixtures. The hybrids of epoxy resin/silicone became transparent with increasing the content of PDMS. The addition of GPTMS resulted in the large increase of transparency of the hybrids even at lower concentration of PDMS. Some opaque hybrid samples showed two glass transition temperatures in the thermograms obtained with differential scanning calorimetery (DSC). In case of the hybrids containing GPTMS, nanoparticles of silica were observed in transmission electron microscopy (TEM) images even though they appeared highly transparent after cure.
  • Keywords
    resins; silicones; cationic polymerization; cycloaliphatic epoxy resin; differential scanning calorimetery; glass transition temperatures; molar ratios; nanoparticles; resin mixtures; silica; silicone hybrids; silicone mixtures; thermograms; transmission electron microscopy image; Aluminum; Curing; Electrons; Epoxy resins; Light emitting diodes; Moisture; Polymers; Temperature; Thermal resistance; Thermal stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-5099-2
  • Electronic_ISBN
    978-1-4244-5100-5
  • Type

    conf

  • DOI
    10.1109/EPTC.2009.5416525
  • Filename
    5416525