• DocumentCode
    3521549
  • Title

    A novel micro pirani gauge with mono-wire sensing unit for microsystem application

  • Author

    Qiu, Yunsong ; Zhao, Lei ; Jin, Yufeng

  • Author_Institution
    Shenzhen Grad. Sch., Peking Univ., Shenzhen, China
  • fYear
    2009
  • fDate
    10-13 Aug. 2009
  • Firstpage
    467
  • Lastpage
    470
  • Abstract
    This paper reports a novel, simple, low-cost and high sensitivity micro Pirani gauge to monitor long-time pressure change and stability inside a vacuum package. The packaging structure is very simple with one wire as sensing part only. Two ends of a metal wire with a certain temperature coefficient of resistance are bonded to the pads of the ceramic structure with a cavity for microsystem application. The metal wire and the packaged part can be formed as a micro Pirani gauge. The dynamic range of this novel Pirani gauge in our experiment is from 1Pa to 100Pa.
  • Keywords
    micromechanical devices; pressure gauges; pressure measurement; stability; ceramic structure; microPirani gauge; microsystem; mono-wire sensing unit; pressure 1 Pa to 100 Pa; pressure change monitoring; stability; temperature coefficient; vacuum package; Biomembranes; Bonding; Dynamic range; Electronic packaging thermal management; Micromachining; Solids; Temperature sensors; Testing; Thermal conductivity; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-4658-2
  • Electronic_ISBN
    978-1-4244-4659-9
  • Type

    conf

  • DOI
    10.1109/ICEPT.2009.5270710
  • Filename
    5270710