• DocumentCode
    3521575
  • Title

    Freeform lens for application-specific LED packaging

  • Author

    Chen, Fei ; Wang, Kai ; Liu, Zongyuan ; Luo, Xiaobing ; Liu, Sheng

  • Author_Institution
    Div. of MOEMS, Wuhan Nat. Lab. for Optoelectron., Wuhan, China
  • fYear
    2009
  • fDate
    10-13 Aug. 2009
  • Firstpage
    443
  • Lastpage
    447
  • Abstract
    Traditional LED packaging always adopts hemisphere lens, although which can ensure high light output efficiency, its light beam is of circular symmetry and non-uniformity. Therefore, LED by traditional packaging cannot be applied in lighting directly and bulky secondary lenses have to be used, which will make the traditional lighting companies difficult to switch to LED lighting and the lamps are heavy. In this study, an effective freeform lens design method for extended light source was presented. With this method, we designed a freeform lens for street lighting, and integrated with this freeform lens, a novel application-specific LED packaging (ASLP), whose manufacturing process can be easily integrated into current LED packaging processes, was suggested. The results of both Monte Carlo ray tracing optical numerical simulation and the experiment show that the light beam is quite in agreement with the design target and the light output efficiency of this novel LED packaging is as high as traditional one. Moreover, comparing with traditional LED module with secondary optics, this novel ASLP module has advantages of higher system light output efficiency (~9%), compact size (~1/8) and convenience for end customers.
  • Keywords
    Monte Carlo methods; lenses; light emitting diodes; semiconductor device packaging; Monte Carlo ray tracing; application-specific LED packaging; circular symmetry; lens design method; light output efficiency; light source; numerical simulation; Design methodology; LED lamps; Lenses; Light emitting diodes; Light sources; Manufacturing processes; Monte Carlo methods; Optical design; Packaging; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-4658-2
  • Electronic_ISBN
    978-1-4244-4659-9
  • Type

    conf

  • DOI
    10.1109/ICEPT.2009.5270713
  • Filename
    5270713