• DocumentCode
    3522295
  • Title

    Cross-layer interaction study on IEEE 802.11e in wireless ad hoc networks

  • Author

    Qin, Yang ; Gwee, Choom Lim ; Seah, Winston

  • Author_Institution
    Nanyang Technol. Univ., Singapore
  • fYear
    2008
  • fDate
    25-27 Aug. 2008
  • Firstpage
    483
  • Lastpage
    487
  • Abstract
    The cross-layer design recently has attracted much research interests to break the traditional network layering norm. However, it is vital to justify the need for understanding cross-layer interaction first before embarking on a cross-layer design. This is because a design without in-depth consideration can easily lead to unwanted interactions, leading to poor network performance. The past research on design of new routing protocols or MAC protocols have been done independently. The purpose of this paper is to investigate the importance of cross-layer interaction between the network layer and some lower layers, e.g. MAC layer and physical layer through the use of a simple experiment. Particularly, our study is on the wireless network based on IEEE 802.11e. Through our study, we highlight the necessity of considering cross-layer dependency when designing new protocols and introduce the possibility cross-layer design in wireless ad hoc network.
  • Keywords
    access protocols; ad hoc networks; mobile radio; routing protocols; wireless LAN; IEEE 802.11e; MAC protocols; cross-layer interaction design; mobile wireless ad hoc networks; routing protocols; wireless LAN; Access protocols; Cross layer design; Media Access Protocol; Mobile ad hoc networks; Mobile communication; Open systems; Physical layer; Routing protocols; Wireless application protocol; Wireless networks; MAC protocols; cross-layer interaction; routing protocols; wireless ad hoc networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Communications and Networking in China, 2008. ChinaCom 2008. Third International Conference on
  • Conference_Location
    Hangzhou
  • Print_ISBN
    978-1-4244-2373-6
  • Electronic_ISBN
    978-1-4244-2374-3
  • Type

    conf

  • DOI
    10.1109/CHINACOM.2008.4685071
  • Filename
    4685071