• DocumentCode
    3522777
  • Title

    Thermal analysis and testing of multi layer ceramic-metal packaged LED

  • Author

    Jin, Peng ; Zhou, Qifeng ; Wu, Na ; Zhong, Qun

  • Author_Institution
    Shenzhen Grad. Sch., Key Lab. of Integrated Microsyst., Peking Univ., Shenzhen, China
  • fYear
    2009
  • fDate
    10-13 Aug. 2009
  • Firstpage
    157
  • Lastpage
    159
  • Abstract
    We studied the thermal properties LED light unit composed of nine LED chips in a MLCMP (multi-layer ceramic-metal package) and compared various thermal dynamic models. We concluded that the direct measurement of forward voltage Vf is the most practical approach for in-situ testing. By calibrating the Vf to junction temperature Tj at various forward current in a temperature controlled oven, the linear relationship of Vf with respect to Tj was obtained and coefficient beta was accurately extracted from experimental data.
  • Keywords
    LED lamps; ceramic products; electronics packaging; thermal analysis; LED light unit; forward voltage; in-situ testing; multilayer ceramic metal package; thermal analysis; thermal dynamic models; thermal properties; Capacitance; LED lamps; Land surface temperature; Light emitting diodes; Packaging; Temperature control; Temperature measurement; Testing; Thermal resistance; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-4658-2
  • Electronic_ISBN
    978-1-4244-4659-9
  • Type

    conf

  • DOI
    10.1109/ICEPT.2009.5270774
  • Filename
    5270774
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3522777