Packaging and assembly of 12-channel parallel optical transceiver module

Author

Li, Zhihua ; Gao, Wei ; Song, Jian ; Li, Baoxia ; Wan, Lixi

Author_Institution

Inst. of Microelectron., Chinese Acad. of Sci., Beijing, China

fYear

2009

fDate

10-13 Aug. 2009

Firstpage

28

Lastpage

30

Abstract

The fabrication process of a 12-channel parallel optical transceiver module developed in our group is presented in this paper. The module is composed of a VCSEL array, a PIN PD array, a VCSEL driver chip, a TIA/LA chip and supporting PCB and connector. A SiOB and its vertical assembly are emphasized as the highlights of the structure of this module, which is promising to effectively reduce the package cost and improve the optical coupling efficiency.

Keywords

optical fabrication; optical interconnections; p-i-n photodiodes; semiconductor device packaging; semiconductor laser arrays; surface emitting lasers; 12-channel parallel optical transceiver module; PCB; PIN PD array; TIA-LA chip; VCSEL array; VCSEL driver chip; connector; device packaging; fabrication process; optical coupling efficiency; optical interconnencts; vertical silicon optical bench assembly; Assembly; Connectors; Costs; High speed optical techniques; Optical arrays; Optical device fabrication; Optical interconnections; Packaging; Transceivers; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-4658-2

Electronic_ISBN

978-1-4244-4659-9

Type

conf

DOI

10.1109/ICEPT.2009.5270802

Filename

5270802