• DocumentCode
    3523434
  • Title

    Strain effects on radiation tolerance of quantum dot solar cells

  • Author

    Kerestes, Christopher ; Forbes, David V. ; Bittner, Zac ; Polly, Stephen ; Lin, Yong ; Richards, Benjamin ; Sharps, Paul ; Hubbard, Seth

  • Author_Institution
    NanoPower Res. Labs., Rochester Inst. of Technol., Rochester, NY, USA
  • fYear
    2012
  • fDate
    3-8 June 2012
  • Abstract
    A comparison of quantum dot (QD) triple junction solar cells (TJSCs) under tensile strain are compared to those under compressive strain and baseline devices to examine the effects of strain induced by the QD layers. It is found that tensile strain leads to degradation of i-region material at values of -706 ppm. Irradiating with 1 MeV electrons triple junction solar cells with tensile strain exhibit a faster degradation in Isc of the QD samples and slower degradation in Voc but overall faster degradation in efficiency compared to baseline TJSCs, regardless of the magnitude of tensile strain. Compressively strain QD TJSCs have similar degradation in Isc and slower degradation in Voc compared to baseline TJSCs. From this study it is determined a strain of +400 ppm in the QD superlattice allows for the best performance pre- and post- irradiation for QD TJSCs based upon AM0 IV and quantum efficiency.
  • Keywords
    semiconductor junctions; semiconductor quantum dots; semiconductor superlattices; solar cells; AM0 IV; QD layers; QD superlattice; QD triple junction solar cells; compressive strain; electron triple junction solar cells; electron volt energy 1 MeV; i-region material; quantum dot solar cells; quantum efficiency; radiation tolerance; strain effects; Degradation; Indexes; Photovoltaic cells; Superlattices; Temperature measurement; Tensile strain; photovoltaic cells; quantum dots;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference (PVSC), 2012 38th IEEE
  • Conference_Location
    Austin, TX
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4673-0064-3
  • Type

    conf

  • DOI
    10.1109/PVSC.2012.6318172
  • Filename
    6318172