• DocumentCode
    3528327
  • Title

    Systematic calibration for transient enhanced diffusion of indium and its application to 0.15-μm logic devices

  • Author

    Lee, Jun-Ha ; Lee, Seung-Woo ; Kong, Jeong-Taek ; Kim, Young-Wug

  • Author_Institution
    Semicond. R&D Center, Samsung Electron. Co. Ltd., Kyungki, South Korea
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    53
  • Lastpage
    56
  • Abstract
    We developed a new systematic calibration procedure which was applied to the calibration of the diffusivity, segregation and TED model of the indium impurity. The TED of the indium impurity has been studied using 4 different groups of experimental conditions. Although the indium is susceptible to the TED, the RTA is effective to suppress the TED effect and maintain a steep retrograde profile. Like the boron, the indium shows significant oxidation-enhanced diffusion in silicon and has segregation coefficients at the Si/SiO2 interface much less than 1. In contrast, however, the segregation coefficient of indium decreases as the temperature increases. The accuracy of the proposed technique is validated by SIMS data and 0.15-μm device characteristics such as Vth and Idsat with errors less than 5% between simulation and experiment
  • Keywords
    MOSFET; calibration; diffusion; doping profiles; elemental semiconductors; indium; logic devices; rapid thermal annealing; secondary ion mass spectra; segregation; silicon; 0.15 micron; MOSFET; RTA; SIMS; Si/SiO2 interface; Si:In-SiO2; TED model; diffusivity; indium impurity profile; logic device; oxidation enhanced diffusion; saturation current; segregation; systematic calibration; threshold voltage; transient enhanced diffusion; Boron; Calibration; Computer aided engineering; Impurities; Indium; Logic devices; Oxidation; Rapid thermal processing; Silicon; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI and CAD, 1999. ICVC '99. 6th International Conference on
  • Conference_Location
    Seoul
  • Print_ISBN
    0-7803-5727-2
  • Type

    conf

  • DOI
    10.1109/ICVC.1999.820820
  • Filename
    820820