• DocumentCode
    3535606
  • Title

    Study of interface behavior on dielectric properties of epoxy-silica nanocomposites

  • Author

    Veena, M. ; Renukappa, N.M. ; Shivakumar, K.N. ; Seetharamu, S.

  • Author_Institution
    Dept. of Electron. & Commun., Sri Jayachamarajendra Coll. of Eng., Mysore, India
  • fYear
    2012
  • fDate
    24-28 July 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper focused on epoxy-based nanodielectric composites with 5, 10, 15 and 20 wt.% of silica constituents prepared using simple mechanical mixing technique along with required curing cycles. The experimentally clarified dielectric constant (ε´) and dissipation factor (tanδ) are influenced by addition of nanosilica is discussed on the basis of the three core interface model proposed for interaction zones. The interfacial region (interaction zone) is likely to be pivotal in controlling properties, the bonding and crosslinking between epoxy-silica was characterized using Fourier transform Infrared Spectroscopy (FTIR) and Differential Scanning Calorimetery (DSC). In addition, Positron Annihilation Lifetime Spectroscopy (PALS) is used to determine free volume of nanocomposites.
  • Keywords
    Fourier transform spectra; differential scanning calorimetry; infrared spectra; materials preparation; mixing; nanocomposites; permittivity; positron annihilation; silicon compounds; DSC; FTIR; Fourier transform infrared spectroscopy; PALS; SiO2; core interface model; dielectric properties; differential scanning calorimetery; dissipation factor; epoxy-based nanodielectric composites; epoxy-silica nanocomposites; experimentally clarified dielectric constant; interaction zones; interface behavior; interfacial region; mechanical mixing technique; nanosilica; positron annihilation lifetime spectroscopy; Degradation; Dielectrics; Fabrication; Materials; OWL; Positrons; Silicon compounds; Dielectric constant; Fourier Transform Infrared Spectroscopy; Free volume; Glass transition temperature; tanδ;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials (ICPADM), 2012 IEEE 10th International Conference on the
  • Conference_Location
    Bangalore
  • ISSN
    2160-9225
  • Print_ISBN
    978-1-4673-2852-4
  • Type

    conf

  • DOI
    10.1109/ICPADM.2012.6318951
  • Filename
    6318951