Verification of thermal analysis of PWBs for RAMCAD

Author

Gore, J.P. ; diMarzo, M. ; Resch, C. ; Pech, M.

Author_Institution

Dept. of Mech. Eng., Maryland Univ., College Park, MD, USA

fYear

1989

fDate

24-26 Jan 1989

Firstpage

474

Lastpage

478

Abstract

Methods involving approximate numerical solutions of the energy equations in two dimensions were developed to allow thermal management and tradeoffs to be conducted efficiently. A validation of the approximate theoretical predictions compared favorably with the experimental data using infrared thermography. Experimental data indicate that infrared thermography provides a method of measuring the temperatures of powered PWBs (printed wiring boards). The overall difference between the measured temperature profile and the calculated temperature profile is within 10%. The discrepancies are thought to be due to uncertainties in material properties and the experimental methods

Keywords

circuit CAD; printed circuit testing; thermal analysis; RAMCAD; approximate numerical solutions; energy equations; infrared thermography; material properties; powered PWBs; printed wiring boards; temperature profile; thermal analysis; thermal management; uncertainties; Educational institutions; Electronic packaging thermal management; Heat transfer; Temperature dependence; Thermal conductivity; Thermal force; Thermal management; Thermal management of electronics; Thermal resistance; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability and Maintainability Symposium, 1989. Proceedings., Annual

Conference_Location

Atlanta, GA

Type

conf

DOI

10.1109/ARMS.1989.49649

Filename

49649