DocumentCode
3538404
Title
Effect of coupling agent on dielectric breakdown of glass-polyamideimide composite films prepared by sol-gel process
Author
Iida, Kazuo ; Masaki, Hunetaka ; Makamura, S. ; Sawa, Goro
Author_Institution
Dept. of Electr. & Electron. Eng., Mie Univ., Tsu, Japan
fYear
1995
fDate
17-20 Sep 1995
Firstpage
343
Lastpage
346
Abstract
We describe the distribution of glass particles in glass-polyamideimide (PAI) composite films prepared by the sol-gel process and discuss effects of the silane coupling agent and the interface between glass and PAI on their dielectric breakdown and their thermal degradation
Keywords
composite insulating materials; composite material interfaces; electric breakdown; filled polymers; organic insulating materials; polymer films; sol-gel processing; dielectric breakdown; glass particles; glass-PAI interface; glass-polyamideimide composite films; silane coupling agent; sol-gel process; thermal degradation; Breakdown voltage; Composite materials; Dielectric breakdown; Glass; Polymer films; Rough surfaces; Silicon; Surface cracks; Surface roughness; Thermal engineering;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulating Materials, 1995. International Symposium on
Conference_Location
Tokyo
Print_ISBN
4-88686-047-8
Type
conf
DOI
10.1109/ISEIM.1995.496579
Filename
496579
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