Signal-power integrity and EMI analysis for singlechip and multi-chip-module applications

In this paper, a global Chip-Package-PCB Co-Design and Co-Verification methodology is successfully applied to Single-Chip Down-converter circuit and Multi-Chip-Module in transmit mode. Full-wave electromagnetic and thermal Co-Analysis approach is adopted to investigate impact of critical RF couplings, power dissipation and grounding strategies on systemlevel performances. The Single-Chip down-converter circuit shows 43dB conversion gain, with 6.5dB noise figure and output IP3 of 18dBm. The MCM design demonstrates 35dBm output IP3, 25dBm output CP1, with 45dB image rejection with 25dB voltage gain for a dissipated power of 2.2W.